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HGTG18N120BND
Data Sheet January 2000 File Number 4555.1
54A, 1200V, NPT Series N-Channel IGBT with Anti-Parallel Hyperfast Diode
The HGTG18N120BND is a Non-Punch Through (NPT) IGBT design. This is a new member of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low onstate conduction loss of a bipolar transistor. The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors. Formerly Developmental Type TA49304.
Features
* 54A, 1200V, TC = 25oC * 1200V Switching SOA Capability * Typical Fall Time. . . . . . . . . . . . . . . . 140ns at TJ = 150oC * Short Circuit Rating * Low Conduction Loss
Packaging
JEDEC STYLE TO-247
Ordering Information
PART NUMBER HGTG18N120BND PACKAGE TO-247 BRAND 18N120BND
NOTE: When ordering, use the entire part number.
Symbol
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,598,461 4,682,195 4,803,533 4,888,627 4,417,385 4,605,948 4,684,413 4,809,045 4,890,143 4,430,792 4,620,211 4,694,313 4,809,047 4,901,127 4,443,931 4,631,564 4,717,679 4,810,665 4,904,609 4,466,176 4,639,754 4,743,952 4,823,176 4,933,740 4,516,143 4,639,762 4,783,690 4,837,606 4,963,951 4,532,534 4,641,162 4,794,432 4,860,080 4,969,027 4,587,713 4,644,637 4,801,986 4,883,767
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 2000
HGTG18N120BND
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified HGTG18N120BND Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 1200 54 26 160 20 30 100A at 1200V 390 3.12 -55 to 150 260 8 15 UNITS V A A A V V W W/oC oC oC s s
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 960V, TJ = 125oC, RG = 3.
Electrical Specifications
PARAMETER
TC = 25oC, Unless Otherwise Specified SYMBOL BVCES BVECS ICES TEST CONDITIONS IC = 250A, VGE = 0V IC = 10mA, VGE = 0V VCE = BVCES TC = 25oC TC = 125oC TC = 150oC TC = 25oC TC = 150oC MIN 1200 15 6.0 100 TYP 300 2.45 3.8 7.0 10.5 165 220 23 17 170 90 1.9 1.8 MAX 250 4 2.7 4.2 250 200 250 28 22 200 140 2.4 2.2 UNITS V V A A mA V V V nA A V nC nC ns ns ns ns mJ mJ
Collector to Emitter Breakdown Voltage Emitter to Collector Breakdown Voltage Collector to Emitter Leakage Current
Collector to Emitter Saturation Voltage
VCE(SAT)
IC = 18A, VGE = 15V
Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA Gate to Emitter Plateau Voltage On-State Gate Charge
VGE(TH) IGES SSOA VGEP QG(ON)
IC = 150A, VCE = VGE VGE = 20V TJ = 150oC, RG = 3, VGE = 15V, L = 200H, VCE(PK) = 1200V IC = 18A, VCE = 0.5 BVCES IC = 18A, VCE = 0.5 BVCES VGE = 15V VGE = 20V
Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy Turn-Off Energy (Note 3)
td(ON)I trI td(OFF)I tfI EON EOFF
IGBT and Diode at TJ = 25oC ICE = 18A VCE = 0.8 BVCES VGE = 15V RG = 3 L = 1mH Test Circuit (Figure 20)
2
HGTG18N120BND
Electrical Specifications
PARAMETER Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy Turn-Off Energy (Note 3) Diode Forward Voltage Diode Reverse Recovery Time TC = 25oC, Unless Otherwise Specified (Continued) SYMBOL td(ON)I trI td(OFF)I tfI EON EOFF VEC trr IEC = 18A IEC = 18A, dIEC/dt = 200A/s IEC = 2A, dIEC/dt = 200A/s Thermal Resistance Junction To Case RJC IGBT Diode NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. TEST CONDITIONS IGBT and Diode at TJ = 150oC ICE = 18A VCE = 0.8 BVCES VGE = 15V RG = 3 L = 1mH Test Circuit (Figure 20) MIN TYP 21 17 205 140 3.7 2.6 2.6 60 44 MAX 26 22 240 200 4.9 3.1 3.2 75 55 0.32 0.75 UNITS ns ns ns ns mJ mJ V ns ns
oC/W oC/W
Typical Performance Curves
60 ICE , DC COLLECTOR CURRENT (A)
Unless Otherwise Specified
ICE, COLLECTOR TO EMITTER CURRENT (A)
120 100 80 60 40 20 0
VGE = 15V 50 40 30 20 10 0 25 50 75 100 125 TC , CASE TEMPERATURE (oC) 150
TJ = 150oC, RG = 3, VGE = 15V, L = 200H
0
200 400 600 800 1000 1200 VCE, COLLECTOR TO EMITTER VOLTAGE (V)
1400
FIGURE 1. DC COLLECTOR CURRENT vs CASE TEMPERATURE
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
3
HGTG18N120BND Typical Performance Curves
fMAX, OPERATING FREQUENCY (kHz)
Unless Otherwise Specified (Continued)
tSC , SHORT CIRCUIT WITHSTAND TIME (s)
TJ = 150oC, RG = 3, L = 1mH, V CE = 960V TC = 75oC, VGE = 15V, IDEAL DIODE 100 50
VCE = 960V, RG = 3, TJ = 125oC
25 ISC 20
250
200
10 fMAX1 = 0.05 / (td(OFF)I + td(ON)I) TC fMAX2 = (PD - PC) / (EON + EOFF) o PC = CONDUCTION DISSIPATION 75oC 75 C (DUTY FACTOR = 50%) 110oC ROJC = 0.32oC/W, SEE NOTES 110oC 1 5 10 20 VGE 15V 12V 15V 12V 30 40
15 tSC 10
150
100
5 12 13 14 15 16 VGE , GATE TO EMITTER VOLTAGE (V)
50
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT
FIGURE 4. SHORT CIRCUIT WITHSTAND TIME
ICE, COLLECTOR TO EMITTER CURRENT (A)
80
ICE, COLLECTOR TO EMITTER CURRENT (A)
100 TC = -55oC 80 TC = 150oC 60 TC = 25oC
60 TC = -55oC 40
TC = 25oC
TC = 150oC 20 DUTY CYCLE < 0.5%, VGE = 12V PULSE DURATION = 250s 0 0 2 4 6 8 10 VCE , COLLECTOR TO EMITTER VOLTAGE (V)
40
20 DUTY CYCLE < 0.5%, VGE = 15V PULSE DURATION = 250s 0 0 2 4 6 8 10 VCE , COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE
12
FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE
4.5 EOFF, TURN-OFF ENERGY LOSS (mJ)
EON2 , TURN-ON ENERGY LOSS (mJ)
RG = 3, L = 1mH, VCE = 960V 10 TJ = 150oC, VGE = 12V, VGE = 15V 8 6 4 2 TJ = 25oC, VGE = 12V, VGE = 15V 0 5 10 15 20 25 30 35 40
RG = 3, L = 1mH, VCE = 960V 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 5 10 15 20 25 30 35 40 TJ = 25oC, VGE = 12V OR 15V TJ = 150oC, VGE = 12V OR 15V
ICE , COLLECTOR TO EMITTER CURRENT (A)
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT
FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT
4
ISC, PEAK SHORT CIRCUIT CURRENT (A)
30
300
HGTG18N120BND Typical Performance Curves
40 tdI , TURN-ON DELAY TIME (ns) RG = 3, L = 1mH, VCE = 960V TJ = 25oC, TJ = 150oC, VGE = 12V trI , RISE TIME (ns)
Unless Otherwise Specified (Continued)
120 RG = 3, L = 1mH, VCE = 960V 100 80 60 40 20 TJ = 25oC, TJ = 150oC, VGE = 12V
35
30
25
20 TJ = 25oC, TJ = 150oC, VGE = 15V 5 10 15 20 25 30 35 40 0 5 10 15 TJ = 25oC OR TJ = 150oC, VGE = 15V 20 25 30 35 40
15
ICE , COLLECTOR TO EMITTER CURRENT (A)
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT
FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT
350 td(OFF)I , TURN-OFF DELAY TIME (ns)
RG = 3, L = 1mH, VCE = 960V
250 225 tfI , FALL TIME (ns)
RG = 3, L = 1mH, VCE = 960V
300 VGE = 12V, VGE = 15V, TJ = 150oC 250
200 175 150 125 100 75 TJ = 25oC, VGE = 12V OR 15V TJ = 150oC, VGE = 12V OR 15V
200
150 VGE = 12V, VGE = 15V, TJ = 25oC 100 5 25 10 15 20 30 35 ICE , COLLECTOR TO EMITTER CURRENT (A) 40
50 25 5 10 15 20 25 30 35 40 ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT
FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER CURRENT
ICE, COLLECTOR TO EMITTER CURRENT (A)
200
150
VGE , GATE TO EMITTER VOLTAGE (V)
DUTY CYCLE < 0.5%, VCE = 20V PULSE DURATION = 250s
20
IG(REF) = 2mA, RL = 33.3, TC = 25oC
15 VCE = 1200V
VCE = 800V
100 TC = 25oC 50 TC = 150oC 0 TC = -55oC 14 15
10 VCE = 400V 5
6
7
9 10 11 12 13 VGE , GATE TO EMITTER VOLTAGE (V)
8
0
0
50
100 QG , GATE CHARGE (nC)
150
200
FIGURE 13. TRANSFER CHARACTERISTIC
FIGURE 14. GATE CHARGE WAVEFORMS
5
HGTG18N120BND Typical Performance Curves
6 FREQUENCY = 1MHz C, CAPACITANCE (nF) 5 4 3 2 1 0 CRES 0 5 10 15 20 25 VCE, COLLECTOR TO EMITTER VOLTAGE (V) CIES
Unless Otherwise Specified (Continued)
ICE, COLLECTOR TO EMITTER CURRENT (A)
30 25
DUTY CYCLE < 0.5%, TC = 110oC PULSE DURATION = 250s VGE = 15V OR 12V
20 VGE = 10V 15 10 5 0
COES
0
1
2
3
4
5
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE
FIGURE 16. COLLECTOR TO EMITTER ON-STATE VOLTAGE
ZJC , NORMALIZED THERMAL RESPONSE
100 0.5 0.2 0.1 10-1 0.05 0.02 0.01 10-2 10-5 SINGLE PULSE 10-4 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZJC X RJC) + TC 10-3 10-2 PD t2 10-1 100 t1
t1 , RECTANGULAR PULSE DURATION (s)
FIGURE 17. NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE
70 100 IF, FORWARD CURRENT (A) 60 t, RECOVERY TIMES (ns) 50 40
TC = 25oC, dIEC/dt = 200A/s
150oC 10
25oC
trr
ta
30 20
1 10 0 1 2 3 4 5 1
tb
2
5 IF, FORWARD CURRENT (A)
10
20
VF, FORWARD VOLTAGE (V)
FIGURE 18. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP
FIGURE 19. RECOVERY TIMES vs FORWARD CURRENT
6
HGTG18N120BND Test Circuits and Waveforms
HGTG18N120BND 90% VGE EOFF VCE L = 1mH 90% RG = 3 + ICE VDD = 960V 10% td(OFF)I tfI trI td(ON)I 10% EON
-
FIGURE 20. INDUCTIVE SWITCHING TEST CIRCUIT
FIGURE 21. SWITCHING TEST WAVEFORMS
Handling Precautions for IGBTs
Insulated Gate Bipolar Transistors are susceptible to gate-insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler's body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as "ECCOSORBDTM LD26" or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate open-circuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended.
Operating Frequency Information
Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 5, 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows fMAX1 or fMAX2; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. td(OFF)I and td(ON)I are defined in Figure 21. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM. td(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RJC. The sum of device switching and conduction losses must not exceed PD. A 50% duty factor was used (Figure 3) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 21. EON is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e., the collector current equals zero (ICE = 0).
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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